Stock Code688359
Stock Code688359
PCB (Printed Circuit Board) is one of the important components of the electronics industry. It plays a role in supporting components and chips within the complete machine, providing interlayer interconnection and conduction, preventing solder bridges and aiding in maintenance identification. PCB specialty chemicals refer to fine chemical materials specifically designed for the PCB manufacturing industry.
Pulse plating refers to PCB electroplating that uses a pulse power supply instead of a direct current power supply. Pulse plating utilizes instantaneous reverse high current to polarize the high potential areas of the PCB, slowing down the copper deposition rate, while the copper deposition rate in the low potential areas is relatively accelerated. This significantly improves the through-hole deep plating capability and the uniformity of the copper plating thickness. Due to the enhanced deep plating capability, it can be applied to high current density production to effectively improve electroplating efficiency.
· Boquan Chemical, a subsidiary of Sanfu, offers pulse plating additives. The PCP365, PCP320, and PCP750 series have been successively used in mass production by several large listed PCB manufacturers, with over a hundred production lines, placing them in a leading position in the market.
· The products have been certified by well-known domestic communication companies. · Mass production of military-grade boards and 5G communication boards has been successful, and in-depth research and testing of the latest generation of 5G board manufacturing is being conducted jointly with leading domestic communication companies, along with collaborative research on high-speed copper plating projects with top domestic science and technology universities.
Pulse Copper Plating PCP365 is a low-cost, high-yield electroplating additive with excellent deep plating capability. Its reliability testing has passed 1000 cycles of the TCT test and is applied in 5G communication boards and military-grade boards.
Used for high-precision microfabrication of conductive wires, connections, electrodes, and conductive plates in the electronics industry.
▪ Can be directly used for via filling electroplating after PTH (Plated Through Hole), featuring strong filling power, thin surface copper, and small dimples.
▪ Boquan Chemical, a subsidiary of Sanfu Tech, offers via filling electroplating additives with the advantages of through-hole and blind-via co-plating, processing deep blind vias, and direct through-hole filling.
Acid copper plating MVF383 is a copper brightener suitable for through-hole and blind via co-plating. It can achieve good via filling effect and ideal surface copper thickness without a pre-wetting step.
01/ Extremely low surface copper control (for 4mil/4mil blind via specifications, surface copper <15μm), suitable for fine line fabrication.
02/ The electroplated copper particles are bright, with fine crystals, good ductility, and excellent uniformity.
03/ Suitable for copper ball anodes and insoluble anodes.
04/ Suitable for rigid boards, flexible boards, and other board substrate series.
Acid copper via filling copper plating MVF385 is an electroplating additive used in plating processes for substrates/package substrates. The carrier and brightener in the MVF385 series have excellent blind via and through-hole filling electroplating capabilities, and the matching inhibitor system can control the surface copper thickness to a thin level.
01/ The MVF385 electroplating series is used for both insoluble and soluble anode electroplating processes.
02/ The plating layer is bright, with fine crystals, good ductility, and high resistance to thermal shock & high reliability.
03/ The working bath can be analyzed and monitored using a Haring Cell and CVS (Cyclic Voltammetric Stripping), making it easy to maintain.
MVF386 Through-Hole Filling Electroplating Process
01/ Suitable for high-difficulty through-hole filling, including through-holes with an aspect ratio of 4:1 on 0.4mm thick boards and mechanically drilled through-holes.
02/ Suitable for both insoluble and soluble anodes.
03/ The plating layer is bright, with fine crystals, good ductility, and uniform copper thickness distribution.
04/ Suitable for rigid boards, flexible boards, and other board substrate series.
The horizontal PTH is an important process in PCB manufacturing, mainly used to metalize the walls of drilled holes. By depositing a thin layer of electroless copper on the insulating hole wall using chemical methods, it serves as the base conductive layer for subsequent copper plating, thereby achieving electrical interconnection between PCB layers.
Product Advantages
· Nickel and EDTA-free
· Less wastewater and copper containing wastewater discharge
· Strong hole filling ability, excellent coating coverage, and stable backlight at level 9 or above, meeting the production needs of high aspect ratio boards
· Excellent reliability of coating layer which can pass 10 thermal shock tests (288 ℃, 10 seconds)
· No activation required for plating, fast deposition rate
· Less consumption of palladium metal and other chemicals, significant energy-saving effect
Paired with DC-105H high-concentration palladium content, suitable for multi-layer precision HDI, resin hole filling, optical module board semiconductors applications, and other high-end PCB applications with special process requirements. Developed and produced for special material processes to meet customers' high-quality requirements for efficient and stable high-end horizontal PTH solution.
Paired with DC-105S low concentration of palladium content, suitable for ordinary double-sided and multi-layer through-hole board production, meeting customers' needs for fast, efficient, stable, and low-cost automatic docking management.
The electroless nickel immersion gold process is a solderable surface coating process for PCBs. It involves depositing an electroless nickel plating layer on the bare copper surface of the PCB through chemical oxidation-reduction reactions by using palladium as a medium. Then, depositing an ultra-thin gold layer on the nickel layer through a semi-replacement and semi-reduction reaction to protect the copper surface from oxidation and corrosion and improve solderability.
Product Advantages
·PCB electroless nickel immersion gold technology is lead, cadmium, and chromium-free.
·The corrosion degree of the gold plating solution on the nickel layer (at via corners) can be controlled within 20%
·The life span of the solution in the electroless nickel immersion gold tank can be controlled at 20～30MTO.
·Excellent solderability, able to withstand 5 reflow soldering cycles
·High surface levelling, easy to weld.
·Strong conductivity, able to be used as a gold finger circuit for key conduction
·Dense crystallization and strong corrosion resistance; excellent oxidation resistance of gold layer
·Long shelf life, can be stored for 1 year after production.
Nickel Layer and Gold Layer (3000X)
Suitable for high-end electroless nickel immersion gold solution for PCB and FPC soft-hard combination series, commonly used for precision PCB with BGA and FPC circuit boards. With excellent flexibility, strong corrosion resistance and thermal shock resistance, excellent immersion gold solderability, enhancing solder fullness, and effectively reducing SMT solder voids and false soldering.
Low phosphorus content, wide application range, achieving good conductivity, and possessing environmental tolerance, which other surface treatment processes do not possess.
Subsidiary : Haoyue New Materials | Ningmei Tech | Guangzhou Etsing Plating Institute | Boquan Chemical | Candice William | GCE | Yiling Smart | Hongway Tech
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